Diptrace remove copper pour9/7/2023 I also applied more pressure and increased the contact time. ![]() I had to turn up the temperature quite a bit to get the solder to flow. My problem is that I had some difficulty soldering these because the copper ground pours have the effect of sinking the heat of the iron. This means that most pads (both SMD and through-hole ones) that are connected to ground ended up having their pad geometries at least partially "merged" with the ground plane, as expected. ![]() When designing the board, I used copper pours on both sides, wherein such pours were connected to the ground network. The board is a mixed/hybrid SMD and through-hole design, with the SMD components all being capacitors and resistors that are only on the bottom side of the board. ![]() The board came back in just 8 days and I'm quite pleased with the quality (though I didn't come close to bumping up against the limits of their design rules and only used DIP chips). I recently soldered up the components for a Propeller-based PCB fabricated with (warning: plug) Seeed Fusion's PCB prototyping service.
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